Plasma processing device and method



A substrate (2) is mounted on a substrate mounting surface (1a) of a substrate mounting base (1). An inductive coupling type plasma torch unit (3) is provided with a rectangular slit-shaped plasma nozzle (4), and is composed of: a cylindrical chamber (7) consisting of a cylinder (5) comprising an insulation material, and lids (6) that cover both ends of the cylinder (5); a gas nozzle (8) that supplies gas to the inside of the cylindrical chamber (7); and a solenoid coil (9) that produces a high-frequency electromagnetic field inside of the cylindrical chamber (7). By supplying high-frequency power to the solenoid coil (9) from a high-frequency power source (41), plasma (P) is generated inside of the cylindrical chamber (7) and is applied to the substrate (2) from the plasma nozzle (4). The substrate surface can be heat treated while the plasma torch unit (3) and the substrate mounting base (1) move relative to each other.




Download Full PDF Version (Non-Commercial Use)

Patent Citations (4)

    Publication numberPublication dateAssigneeTitle
    CN-1670912-ASeptember 21, 2005株式会社液晶先端技术开发中心等离子体处理设备和等离子体处理方法
    CN-1685079-AOctober 19, 2005凸版印刷株式会社Method for forming thin film, apparatus for forming thin film, and method for monitoring thin film forming process
    JP-2007227069-ASeptember 06, 2007Noritsu Koki Co Ltd, ノーリツ鋼機株式会社Method and device for generating plasma, and workpiece treatment device using the same
    US-6073578-AJune 13, 2000Electronics And Telecommunications Research InsituteRF induction plasma source generating apparatus

NO-Patent Citations (0)


Cited By (5)

    Publication numberPublication dateAssigneeTitle
    CN-103052249-AApril 17, 2013哈尔滨工业大学Jet plasma density distribution adjuster
    CN-105448636-AMarch 30, 2016松下知识产权经营株式会社等离子体处理装置、等离子体处理方法和制造电子器件的方法
    CN-105448636-BNovember 10, 2017松下知识产权经营株式会社等离子体处理装置、等离子体处理方法和制造电子器件的方法
    CN-105491779-AApril 13, 2016周开根一种电离协同的等离子体热解装置
    CN-105491779-BSeptember 29, 2017衢州昀睿工业设计有限公司一种电离协同的等离子体热解装置